RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID

SKU: PPA322451
10,50
In Stock

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin such as:
Phenolic Resin 
Epoxy Resin 
Acrylic Resin,
Polyurethane,
Silicone Resin

In stock

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin such as:
Phenolic Resin 
Epoxy Resin 
Acrylic Resin,
Polyurethane,
Silicone Resin
etc

Additional information

Weight 0,10 kg

Customer reviews

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may write a review.