RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
SKU: PPA322451
€10,50
In Stock
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin such as:
Phenolic Resin
Epoxy Resin
Acrylic Resin,
Polyurethane,
Silicone Resin
In stock
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin such as:
Phenolic Resin
Epoxy Resin
Acrylic Resin,
Polyurethane,
Silicone Resin
etc
Additional information
Weight | 0,10 kg |
---|
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