Solder Paste Baku BGA BK-051 50GR
BGA soldering paste Baku BK-051G, alloy:sn 63% pb 37%, 50gr
In stock
Harmeful by inhalation and if swallowed (R 20/22)
Danger of cumulative effects(R 33)
Keep away from food,drink an animal feeding stuffs(S 13)
When using do not eat,drink of smoke(S 20/21)
Avoid prolonged repeated contact of any skin with solder paste, in case of solder paste ingestion see a doctor immediately.
Store container well closed and cool(at 5~10°C)
Alloy:sn 63% pb 37%
Mirons:25~45um
Net:50g(5~10°C)
Only use in the adequate ventilated palce.
Applicable scope:
Phone chip repair, computer or home appliance repair patch chip BGA-specific products.
Function:
This is a must for small precision and mobile equipment maintenance products,Electronics and the production line, the best welding supplies.
Additional information
Weight | 0,10 kg |
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