IPHONE X REMOVAL NOZZLE FOR QUICK 861DW

SKU: PPA110841
6,50
In Stock

Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW
Dedicated for iPhone X motherboard
Protect the NAND/PCIE, CPU, WIFI, baseband

In stock

Mijing Special Design Hot Air Gun Nozzle
Heat Gun Rework Nozzle for Quick 861DW  for Repair iPhone X Motherboard Mainboard
Dedicated for iPhone X motherboard, special design, easy and quick disassembly of double-layer motherboard
Protect the NAND/PCIE, CPU, WIFI, baseband, does not cause imaginary welding
Compatible only for Quick 861DW AND TR1300

Additional information

Weight 0,05 kg

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