WL HIGH-QUALITY REBALLING STENCIL A11-2 CPU

 
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BGA Reballing Stencil Tin Steel for iPhone A11 CPU
With Fixed Plate
Easy to use and more accurate IC welding position
Package includes:
1x Stainless Stencil
1x Heat resistant mould in Synthetic Stone

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BGA Reballing Stencil Tin Steel for iPhone A11-2 CPU
With Fixed Plate
Easy to use and more accurate IC welding position
Package includes:
1x Stainless Stencil
1x Heat resistant mould in Synthetic Stone

 

Additional information

Weight 0.05 kg

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