WL 2 IN1 CPU/NAND BGA Magnetic REBALLING STENCIL IPHONE 6 TO XS MAX (A8/A12)
€8,95 – €12,50
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WL 2 IN1 CPU NAND BGAReballing Stencil Platform For iPhone 6/6S/7/8/X/XR/XS/XSMAX
CPU and NAND, A9 / A8 /A10/A11/A12
Thickness 0.1-0.12 mm
High hardness,
Hardly deformed
WL 2 IN1 CPU NAND BGAReballing Stencil Platform For iPhone 6/6S/7/8/X/XR/XS/XSMAX
CPU and NAND, A9 / A8 /A10/A11/A12
Thickness 0.1-0.12 mm
High hardness,
Hardly deformed
Increase the success rate on BGA reballing Solder working
Best quality BGA Reballing Stencil for iPhone CPU and NAND, A9 / A8 /A10/A11/A12
WL Top quality Fast Speed BGA reballing Solder template stencil
Please Note:
To use the kit properly, the Metal Magnetic Base is required
Additional information
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