WL 2 IN1 CPU/NAND BGA Magnetic REBALLING STENCIL IPHONE 6 TO XS MAX (A8/A12)

 
8,9512,50
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WL 2 IN1 CPU NAND BGAReballing Stencil Platform For iPhone 6/6S/7/8/X/XR/XS/XSMAX
CPU and NAND, A9 / A8 /A10/A11/A12
Thickness 0.1-0.12 mm
High hardness,
Hardly deformed

Clear

WL 2 IN1 CPU NAND BGAReballing Stencil Platform For iPhone 6/6S/7/8/X/XR/XS/XSMAX
CPU and NAND, A9 / A8 /A10/A11/A12
Thickness 0.1-0.12 mm
High hardness,
Hardly deformed
Increase the success rate on BGA reballing Solder working
Best quality BGA Reballing Stencil for iPhone CPU and NAND, A9 / A8 /A10/A11/A12
WL Top quality Fast Speed BGA reballing Solder template stencil
Please Note:
To use the kit properly, the Metal Magnetic Base is required

 

Additional information

Model

A10 CPU NAND, A11 CPU NAND, A12 CPU NAND, A8 CPU NAMD, A9 CPU NAND, WL 2in1 Magnetic Base

Dimensions
Weight N/A

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