UNIVERSAL HARD DISK BGA REBALLING STENCIL MJ FOR IPHONE/IPAD SERIES

SKU: PPA171871
3,25
In Stock

High precision BGA reballing stencil for iPad/iPhone Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip

In stock

High precision BGA reballing stencil for iPad/iPhone Series
This product adopts import material and advanced technology
Can be laser engraving custom logo and text content
Precision square hole, one molding, improve working efficency
Fast allignement of the chip foot, the hole wall is uniform without burr
Unique heat dissipation drum package design
Steel has strong toughness ans is not easy to deform
Mijing Mobile Phone Tools

Additional information

Weight 0,05 kg

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