IPHONE X REMOVAL NOZZLE FOR QUICK 861DW
SKU: PPA110841
€6,50
In Stock
Special Design Hot Air Gun Nozzle Heat Gun Rework Nozzle for Quick 861DW
Dedicated for iPhone X motherboard
Protect the NAND/PCIE, CPU, WIFI, baseband
In stock
Mijing Special Design Hot Air Gun Nozzle
Heat Gun Rework Nozzle for Quick 861DW for Repair iPhone X Motherboard Mainboard
Dedicated for iPhone X motherboard, special design, easy and quick disassembly of double-layer motherboard
Protect the NAND/PCIE, CPU, WIFI, baseband, does not cause imaginary welding
Compatible only for Quick 861DW AND TR1300
Additional information
Weight | 0,05 kg |
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