HIGH PRECISION BGA REBALLING STENCIL MJ FOR IPAD SERIES

 
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High precision BGA reballing stencil for iPad Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip

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High precision BGA reballing stencil for iPad Series
This product adopts import material and advanced technology
Can be laser engraving custom logo and text content
Precision square hole, one molding, improve working efficency
Fast allignement of the chip foot, the hole wall is uniform without burr
Unique heat dissipation drum package design
Steel has strong toughness ans is not easy to deform
Mijing Mobile Phone Tools

Additional information

Model

iPad Pro9.7-12.9, iPad2-3-4-Mini1, iPad5-iPad Mini2-3, iPad6-iPad Mini4

Dimensions
Weight 0,05 kg

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