Genuine Desoldering Wick Chemtronics

Soder-Wick® offers the state of the art in desoldering technology.
Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures.
Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.
Soder-Wick® Rosin 5′ and 10′ spools packaged in ESD-safe static dissipative bobbins
Minimizes the risk of damage associated with static electricity
Noncorrosive ultra high purity Type R rosin flux
Minimizes the risk of heat damage to the board
Will not leave ionic contamination on the boards

Applications
Soder-Wick® Rosin safely removes solder in all applications requiring Type ROL0 rosin flux
BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes

Specifications:
MIL-F-14256 F type R flux
MIL-STD-2000A
MIL-B-81705C
MIL-STD-1686C
MIL-HDBK-263B
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
ANSI/IPC J STD-004, Type ROL0
ANSI/IPC J SF-818
Bellcore TR-NWT-000078

Additional information