2UUL BGA REBALLING STENCIL FOR IPHONE 6 TO 12 PRO MAX
Thickness: 0.12mm
Stepped groove design enables stencil to align with the tinning position of ic rapidly
The square holes design makes it easier to take out the formed solder balls.
Thickness: 0.12mm
Stepped groove design enables stencil to align with the tinning position of ic rapidly.
The square holes design makes it easier to take out the formed solder balls.
This stencil is easy to use, no matter you are new or an expert.
With the high success rate of planting tin, the solder balls can be formed once you are proficient.
This planting stencil is thicker than ordinary stencils in the market.
Less tendency of deformation makes its using life be longer.
Support:
iPhone 6, 6P, 6S, 6SP,7, 7P, 8, 8P,
iPhone X, XS, XS Max, XR,
iPhone 11, 11 Pro, 11 Pro Max
iPhone 12 Mini, 12, 12 Pro, 12 Pro Max.
Additional information
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