Water-washable universal tacky solder flux
– REL0 flux classification
– Optimized for lead-free and standard alloy systems
– Wide process window
– Residue can be left on the board in most assemblies
– Excellent wetting compatibility on most board finishes
– Ultra-low voiding, including LGA (Land Grid Array) packages
– REACH compliant

Universal no-clean tacky solder flux with extremely low voiding (the lowest among all AMTECH no-clean fluxes!)
– ROL0 flux classification
– Optimized for lead-free and standard alloy systems
– Designed for LGA, BGA, and CSP components
– Halogen-free per EN14582 test method
– Excellent wetting on all common surface finishes
– Clear residue
– Low voiding
– REACH compliant

High activity rosin mildly active tacky solder flux for military/avionics
– ROL0 flux classification
– Wide process window
– Excellent wetting compatibility on most board finishes
– Low voiding
– REACH compliant
– Contains UV trace