Applicable models of Motherboard
This device is suited for 3 iPhone models
This device can be used to disassemble motherboard of iPhone X/XS/XS MAX
Its surface is designed for these motherboards to fit perfectly!!
QianLi-Mega Idea Hot Stone Heating Platform
For Chips of Finger Print Cable, Hard Disk, CPU
One Platform for kinds of chips
For Soldering and unsoldering chips
For Removing Glue
Special heating designed and precise, temperature control capability
Only heating the area that needs to be removed
High purity copper, dual bayonet design
1x Central Unit Station (T 12A)
1x iPhone X3 (T12A-X3) iPhone X-XS-XS Max
1x iPhone Android (T12A Android)
1x iPhone Face & ID (T12A Face)
1x CPU heating base (T12A-CPU)
1x Degumming Heating Mould (T12 A-F)
Mechanic Mini Thermostat Welding Platform
Rework Station Heater for CPU A8 A9 A10 A11 A12 Separate and Fit.
No need the hot Air Rework station, special design for Disassembly and Welding
Mechanic economic mini thermostat Desoldering Rework Station
Heater for iPhone X Mainboard Separate and Fit.
Note: working on 230℃,
Special design for iPhone X CPU Disassembly and Welding
MiJing CH5 Intelligent Mainboard Layered Welding Platform for iPhone X/XS/XSMAX
Three-in-one universal iPhone X/XS/XSMAX,
Support A11 A12 CPU chip,
Support A11 A12 HHD,
iPhone X Baseband,
iPhoneXS/XSMAX baseband and glue removal.
Available for all Android and iPhone Motherboard
With the rotating clamp, it can be used on any motherboard