Solder Spheres are Tin-Lead eutectic solder spheres for BGA and CSP components
Lead-free (Pb-free) soldering.
Tin (Sn): 63%,
Lead (Pb): 37%,
Melting Temperature (Eutectic): 183°C
Package included :
4 x 25k solder balls (0.45mm 0.5mm 0.6mm 0.76mm)
Edsyn professional solder paste 5ml, lead-free, Sn42Bi58, F-SW32, 215 °C
Type of alloy: Sn42Bi58, Flux type: F-SW32, lead-free
Min. processing temperature: 215 °C, max. processing temperature: 260 °C
Producer: Edsym GMBH, Germany
Melting Point: 138°c
Ingredient: Sn99% Cu 0,7% Ag 0,7%
Having a large insulation resistance does not corrode the PCB
High impedance, full and bright solder, low residue.
RELIFE 183℃ Solder paste RL-400-401-402-403
Model: RL-4 Series
RELIFE, real quality, born for mobile repair.
High viscosity no-clean flux, it can be used for PCB, SMD
Microns: 25-45 um
High-quality alloyed powder and resinic pasty flux