High precision BGA reballing stencil for iPhone Series
This product adopts import material and advanced technology
Precision square hole, one molding,
Fast allignement of the chip
PCB holder high quality multifunctional iPhone, high temperature resistant
Available for different sections for iPhone,
CPU NAND, chips positioning, soldering, desoldering, reballing, etc.
The first PCB repair platform uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC